2025北京半导体展将于5月21日至5月23日举行

2025北京半导体展将于5月21日至5月23日在中国（北京）国际展览中心（老馆）隆重举行。本次展会聚焦全球半导体行业最新技术和产品，涵盖芯片设计、晶圆制造、封装测试、半导体设备及材料等多个领域，致力于推动半导体产业链的创新发展，为行业提供高效的交流与合作平台。

展会亮点

本届展会将集中展示前沿半导体技术，包括先进制程工艺、第三代半导体材料、人工智能芯片、高性能计算及5G芯片等。

同期将举办半导体产业高峰论坛，邀请国内外知名专家、企业高管及科研机构代表，共同探讨全球半导体行业的发展趋势、市场机遇及技术创新方向。

现场设有技术演示区，展示芯片制造、封装测试、半导体设备的最新应用，帮助企业直观了解行业前沿动态。

展会简介

北京半导体展是国内领先的半导体行业盛会，汇聚全球半导体企业及产业链上下游企业，提供涵盖技术展示、商务洽谈、市场拓展的综合性交流平台。展会立足北京，辐射全国及国际市场，助力半导体产业的高速发展。

展品范围

芯片设计与制造：

涵盖集成电路设计、EDA工具、晶圆制造工艺、先进封装技术及测试解决方案。

半导体设备及材料：

展示光刻机、刻蚀机、清洗设备、检测设备、半导体级硅片、化合物半导体材料、光刻胶等。

功率与射频半导体：

包括功率MOSFET、IGBT、SiC/GaN器件、射频芯片、MEMS传感器等。

存储与计算芯片：

涵盖DRAM、NAND Flash、存内计算芯片、高性能计算芯片及AI芯片。

半导体应用方案：

展示半导体在汽车电子、5G通信、消费电子、工业控制、医疗电子等领域的应用方案。

展商

本届展会预计将吸引中芯国际、华虹半导体、台积电、三星电子、英特尔、AMD、英伟达、安森美、意法半导体、罗姆半导体、紫光集团、兆易创新等国内外知名半导体企业参展，集中展示全球半导体行业的最新技术成果。

The 2025 Beijing Semiconductor Expo will take place from May 21 to May 23, 2025, at the China (Beijing) International Exhibition Center (Old Venue). This exhibition will focus on the latest global semiconductor technologies and products, covering chip design, wafer manufacturing, packaging and testing, semiconductor equipment, and materials. It aims to promote innovation across the semiconductor industry and provide an efficient platform for networking and collaboration.

Exhibition Highlights

The event will showcase cutting-edge semiconductor technologies, including advanced manufacturing processes, third-generation semiconductor materials, AI chips, high-performance computing, and 5G chip solutions.

A high-level semiconductor industry forum will be held concurrently, featuring industry experts, business executives, and researchers to discuss global semiconductor trends, market opportunities, and technological advancements.

A dedicated technology demonstration area will present the latest applications in chip manufacturing, packaging, and testing, allowing attendees to gain first-hand insights into the industry's future.

Exhibition Overview

The Beijing Semiconductor Expo is a premier industry event in China, bringing together global semiconductor companies and supply chain enterprises. The exhibition provides a comprehensive platform for showcasing technology, business matchmaking, and market expansion. Positioned in Beijing, it connects the domestic and international markets, supporting the rapid growth of the semiconductor sector.

Exhibit Categories

Chip Design & Manufacturing:

Includes IC design, EDA tools, wafer fabrication processes, advanced packaging technologies, and testing solutions.

Semiconductor Equipment & Materials:

Showcases lithography machines, etching equipment, cleaning systems, inspection tools, semiconductor-grade silicon wafers, compound semiconductor materials, and photoresists.

Power & RF Semiconductors:

Covers power MOSFETs, IGBTs, SiC/GaN devices, RF chips, and MEMS sensors.

Memory & Computing Chips:

Includes DRAM, NAND Flash, in-memory computing chips, high-performance computing chips, and AI chips.

Semiconductor Application Solutions:

Demonstrates semiconductor applications in automotive electronics, 5G communication, consumer electronics, industrial control, and medical electronics.

Exhibitors

Leading semiconductor companies such as SMIC, Hua Hong Semiconductor, TSMC, Samsung Electronics, Intel, AMD, NVIDIA, ON Semiconductor, STMicroelectronics, ROHM Semiconductor, Tsinghua Unigroup, and GigaDevice are expected to participate, showcasing the latest innovations in the global semiconductor industry.

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